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CoreFlow Korea
Why visit our stand
If you are looking for warpage solution of wafer & panel level packaging(PLP), you can find the answer from the CoreFlow's GripJet Technology with improved productivity and cost-effciency.
Description
Since 1999, CoreFlow has developed innovative Aeromechanical technologies for substrate handling, acquiring and flattening. CoreFlow delivered to date more than 1,000 aeromechanical substrate handling systemms for the Semiconductor FEOL, BEOL, AWLP(Advanced Wafer Level Packkaging), PLP(Panel Level Packaging), FPD(Flat Panel Display) non-contact accurate glass handling systems.
Brands we represent
SmartNozzle, GripJet Vacuum Stage, GripJet Chuck, Selective Vacuum Chuck, End Effector
CATEGORIES (1)
Exhibition
PRODUCTS (5)
COMPANY CONTACTS
COMPANY ADDRESS
South Korea#1801, 614 Dongtangiheung-ro, Hwaseong-si, Gyeonggi-do, Korea 18469
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