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Laser processing has been attracting attention for cutting many materials, including films. However, the trade-off between processing quality and processing capacity has been an issue in conventional
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  • FINE PROCESS TECHNOLOGY EXPO
■Custom-made-solder-composition ■Ultra fine flux cored solder(φ50 μm) ■Low Temperature Solder ■Thermal Fuse ■MicroDC fuse (DC450V) ■Battery OV protection (3 terminal fuse) ■Resistor for OBC (AEC-Q200)
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  • FINE PROCESS TECHNOLOGY EXPO
東京電子工業は、セラミックスやガラス、複合材加工のエキスパートです。 他社で困難な硬くて脆い素材でも、超精密に短納期で加工いたします。 ご依頼いただいた加工案件は、100,000件以上におよび、試作品や量産品を問わず、お客様のハイレベルな要求に品質とスピードでお応えします。
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  • FINE PROCESS TECHNOLOGY EXPO