NEPCON JAPAN Post Show Report
Post Show Report
Date: January 22-24, 2025
Venue: Tokyo Big Sight, Japan
No. of Exhibitors
Including Concurrent Shows:
1,711
Exhibitors
No. of Visitors
Including Concurrent Shows:
85,430
Visitors
No. of Conference Sessions
No. of Conference Sessions
Including Concurrent Shows:
200
Speakers
Exhibitors Gathered from 24 Countries/Regions
Exhibitors Gathered
from 24
Countries/Regions
- Australia
- Austria
- China
- Czech Republic
- Estonia
- Germany
- Hong Kong
- India
- Israel
- Japan
- Malaysia
- Monaco
- Poland
- Portugal
- Singapore
- South Korea
- Sweden
- Switzerland
- Taiwan
- Thailand
- Turkey
- United Kingdom
- United States
- Vietnam
Visitors gathered from 56 Countries/Regions.
Visitors gathered from
56 Countries/Regions.
- Aland Islands
- Australia
- Austria
- Azerbaijan
- Belgium
- Brazil
- Cambodia
- Canada
- Chile
- China
- Colombia
- Czechia
- Denmark
- Finland
- France
- Germany
- Greece
- Guatemala
- Hong Kong
- Hungary
- India
- Indonesia
- Iran
- Israel
- Italy
- Korea
- Kuwait
- Lithuania
- Luxembourg
- Macao
- Malaysia
- Malta
- Mongolia
- Netherlands
- New Caledonia
- Norway
- Philippines
- Poland
- Portugal
- Saudi Arabia
- Singapore
- Spain
- Sri Lanka
- Sweden
- Switzerland
- Taiwan
- Thailand
- Timor-Leste
- Turkiye
- Ukraine
- United Arab Emirates
- United Kingdom
- United States
- United States Minor Outlying Islands
- Uzbekistan
- Viet Nam
Conference Speakers (excerpts)
Advanced Packaging in the Era of HPC and AI
Jeongho Lee
Director, Package Development Team in Test & System Package
Samsung Electronics Co., Ltd.
Advanced Packaging of AI Module
Yang Zhang
Senior Director of Engineering,
Central Hardware Systems
Qualcomm Technologies Inc.
Generative AI Framework for Enterprise
Toshihiro Sonoda
Head of Artificial Intelligence, Artificial Intelligence Lab., Fujitsu Research,
Fujitsu Ltd.
Quality Assurance Strategy Utilizing International Standards
Hisao Nishimori
Group Manager, Software Development Center, Digital & Software Performance Development Div.,
Toyota Motor Corp.
Latest Technology Trends in In-vehicle Power Modules and Power Devices for the Widespread Adoption of xEVs
Yukihiro Takahashi
Director, Electrification Components Eng.Div.3
DENSO Corp.
HBM Leadership in AI and HPC SK hynix's Strategy and Outlook
Hyunwoo Kim
Director, HBM Design Dept.
SK hynix Inc.
East Halls
Exhibitions held inside East Halls
・NEPCON JAPAN 2025
・17th AUTOMOTIVE WORLD
South Halls
Exhibitions held inside South Halls
・11th WEARABLE EXPO
・FACTORY INNOVATION WEEK 2025
・4th SMART LOGISTICS Expo